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  low-power off-line primary side regulation controller ap3766 preliminary datasheet 1 bcd semiconductor manufacturing limited aug. 2010 rev. 1. 2 general description the ap3766 is a high performance ac/dc power sup- ply controller for led driv ers, battery charger and adapter applications. the device uses pulse frequency modulation (pfm) method to build discontinuous con- duction mode (dcm) flyback power supplies. the ap3766 provides accurate constant voltage, con- stant current (cv/cc) regulation while removing the opto-coupler and secondary control circuitry. it also eliminates the need of lo op compensation circuitry while maintaining stability. the ap3766 achieves excellent regulation and high average efficiency, yet meets the requirement for no-load consumption less than 30mw. the ap3766 is available in sot-23-6 package. features primary side control for rectangular constant current and constant voltage output sub-microampere start-up current 30mw no-load input power feasible tight cc regulation performance eliminates opto-coupler and secondary cv/cc control circuitry eliminates control loop compensation circuitry flyback topology in dcm operation random frequency modulation to reduce system emi built-in soft start open feedback protection short circuit protection sot-23-6 package applications led drivers adapters/chargers for cell/cordless phones, pdas, mp3 and other portable apparatus standby and auxiliary power supplies figure 1. package type of ap3766 sot-23-6
low-power off-line primary side regulation controller ap3766 preliminary datasheet 2 bcd semiconductor manufacturing limited aug. 2010 rev. 1. 2 pin configuration figure 2. pin configuration of ap3766 (top view) 1 2 34 5 pin 1 dot by marking 6 cs out vcc gnd fb gnd k6 package (sot-23-6) pin description pin number pin name function 1 out this pin drives the base of external power npn switch 2, 5 gnd ground 3 vcc supply voltage 4 cs the primary current sense 6 fb the voltage feedback from the auxiliary winding
low-power off-line primary side regulation controller ap3766 preliminary datasheet 3 bcd semiconductor manufacturing limited aug. 2010 rev. 1. 2 regulator & bias tonsec detector 0.1v 4.0v pfm tons comp ea uvlo cv_ctrl pfm driver rq s rq s cc_ctrl 3 1 2, 5 4 6 ockp peak current control & leb constant current control tons constant voltage control functional block diagram figure 3. functional block diagram of ap3766 out gnd fb cs vcc
low-power off-line primary side regulation controller ap3766 preliminary datasheet 4 bcd semiconductor manufacturing limited aug. 2010 rev. 1. 2 parameter value unit supply voltage vcc -0.3 to 36 v voltage at cs, out to gnd -0.3 to 7 v fb input -40 to 10 v output current at out internally limited a operating junction temperature 150 o c storage temperature -65 to 150 o c lead temperature (soldering, 10s) 300 o c thermal resistance junction-to-ambient 250 o c/w esd (machine model) 200 v esd (human body model) 2000 v note 1: stresses greater than those li sted under "absolute maximum ratings" may cause permanen t damage to the device. these are stress ratings only, and functiona l operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. exposure to "absol ute maximum ratings" for extended periods may affect device reliability. absolute maximum ratings (note 1) bcd semiconductor's products, as designa ted with "g1" suffix in the part number, are rohs compliant and green. ordering information circuit type ap3766 - tr: tape and reel package g1: green package temperature range part number marking id packing type sot-23-6 -40 to 105 o c AP3766K6TR-G1 gbf tape & reel k6: sot-23-6
low-power off-line primary side regulation controller ap3766 5 bcd semiconductor manufacturing limited aug. 2010 rev. 1. 2 preliminary datasheet parameter symbol conditions min typ max unit uvlo section start-up threshold v th (st) 16 18.5 21 v minimal operating voltage v opr (min) 7.2 9 10.2 v standby current section start-up current i st v cc =v th (st) -0.5v, before start-up 0.6 a operating current i cc(opr) static 200 320 a drive output section out maximum current sink i out 50 ma source 24 30 36 current sense section current sense threshold v cs 455 510 545 mv equivalent current se nse voltage accuracy note 2 3 % pre-current sense v cs(pre) 365 410 455 mv leading edge blanking 750 ns feedback input section feedback pin input leakage current i fb v fb =4v 2.0 2.5 3.1 a feedback threshold v fb 3.59 3.83 4.07 v (v cc =15v, t a =25 o c, unless otherwise specified.) electrical characteristics note 2: the output current is given by i out = . x eq vcs, eq vcs, ? ns np x rcs eq vcs,
low-power off-line primary side regulation controller ap3766 preliminary datasheet 6 bcd semiconductor manufacturing limited aug. 2010 rev. 1. 2 typical performance characteristics figure 4. start-up voltage vs. ambient temperature -40 -20 0 20 40 60 80 100 120 16 17 18 19 20 21 start-up voltage (v) ambient temperature ( o c) -40 -20 0 20 40 60 80 100 120 7.5 8.0 8.5 9.0 9.5 10.0 10.5 minimal operating voltage (v) ambient temperature ( o c) figure 5. mininal operating voltage vs. ambient temperature figure 6. operating current vs. ambient temperature -40-20 0 20406080100120 100 120 140 160 180 200 220 240 260 280 300 operating current ( a) ambient temperature ( o c) figure 7. i fb vs. ambient temperature -40 -20 0 20 40 60 80 100 120 0 1 2 3 4 5 6 i fb ( a) ambient temperature ( o c)
low-power off-line primary side regulation controller ap3766 7 bcd semiconductor manufacturing limited aug. 2010 rev. 1. 2 preliminary datasheet figure 8. 5v/700ma output for battery charger of mobile phone typical application + c1 + c4 v o + v o - d2 r1 r3 r4 rs q1 r6 r7 t1 d1 c2 vcc out fb cs gnd ap3766 ns + r5 c3 d3 r2 n v fb n v p
low-power off-line primary side regulation controller ap3766 preliminary datasheet 8 bcd semiconductor manufacturing limited aug. 2010 rev. 1. 2 mechanical dimensions unit: mm(inch) sot-23-6 2.820(0.111) 3.020(0.119) 2.650(0.104) 2.950(0.116) 1.500(0.059) 1.700(0.067) 0.950(0.037)typ 1.800(0.071) 2.000(0.079) 0.300(0.012) 0.400(0.016) 0.700(0.028)ref 0.100(0.004) 0.200(0.008) 0 8 0.200(0.008) 0.300(0.012) 0.600(0.024) 0.000(0.000) 0.150(0.006) 0.900(0.035) 1.300(0.051) 1.450(0.057) max 123 4 5 6 pin 1 dot by marking
important notice bcd semiconductor manufacturing limited reserves the right to make changes without further not ice to any products or specifi- cations herein. bcd semiconductor manufacturing limited does not as sume any responsibility for us e of any its products for any particular purpose, nor does bcd semiconductor manufacturi ng limited assume any liability aris ing out of the application or use of any its products or circui ts. bcd semiconductor manufacturing limited does not convey any license under its patent rights or other rights nor the rights of others. - wafer fab shanghai sim-bcd semiconductor manufacturing co., ltd. 800 yi shan road, shanghai 200233, china tel: +86-21-6485 1491, fax: +86-21-5450 0008 main site regional sales office shenzhen office shanghai sim-bcd semiconductor manuf acturing co., ltd., shenzhen office unit a room 1203, skyworth bldg., gaoxin ave.1.s., nanshan district, shenzhen, china tel: +86-755-8826 7951 fax: +86-755-8826 7865 taiwan office bcd semiconductor (taiwan) company limited 4f, 298-1, rui guang road, nei-hu district, taipei, taiwan tel: +886-2-2656 2808 fax: +886-2-2656 2806 usa office bcd semiconductor corp. 30920 huntwood ave. hayward, ca 94544, usa tel : +1-510-324-2988 fax: +1-510-324-2788 - headquarters bcd semiconductor manufacturing limited no. 1600, zi xing road, shanghai zizhu sc ience-based industrial park, 200241, china tel: +86-21-24162266, fax: +86-21-24162277 bcd semiconductor manufacturing limited important notice bcd semiconductor manufacturing limited reserves the right to make changes without further not ice to any products or specifi- cations herein. bcd semiconductor manufacturing limited does not as sume any responsibility for us e of any its products for any particular purpose, nor does bcd semiconductor manufacturi ng limited assume any liability aris ing out of the application or use of any its products or circui ts. bcd semiconductor manufacturing limited does not convey any license under its patent rights or other rights nor the rights of others. - wafer fab shanghai sim-bcd semiconductor manufacturing limited 800, yi shan road, shanghai 200233, china tel: +86-21-6485 1491, fax: +86-21-5450 0008 bcd semiconductor manufacturing limited main site regional sales office shenzhen office shanghai sim-bcd semiconductor manuf acturing co., ltd. shenzhen office advanced analog circuits (shanghai) corporation shenzhen office room e, 5f, noble center, no.1006, 3rd fuzhong road, futian district, shenzhen 518026, china tel: +86-755-8826 7951 fax: +86-755-8826 7865 taiwan office bcd semiconductor (taiwan) company limited 4f, 298-1, rui guang road, nei-hu district, taipei, taiwan tel: +886-2-2656 2808 fax: +886-2-2656 2806 usa office bcd semiconductor corporation 30920 huntwood ave. hayward, ca 94544, u.s.a tel : +1-510-324-2988 fax: +1-510-324-2788 - ic design group advanced analog circuits (shanghai) corporation 8f, zone b, 900, yi shan road, shanghai 200233, china tel: +86-21-6495 9539, fax: +86-21-6485 9673 bcd semiconductor manufacturing limited http://www.bcdsemi.com bcd semiconductor manufacturing limited


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